via semiconductor

A semiconductor substrate is etched to form a via hole from a back surface of the semiconductor substrate to a pad elect...

via semiconductor

A semiconductor substrate is etched to form a via hole from a back surface of the semiconductor substrate to a pad electrode. This etching is performed under an ... ,Through-glass vias (TGV) have been studied by Corning Glass for semiconductor packaging, due to the reduced electrical loss of glass versus silicon packaging.

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via semiconductor 相關參考資料
Through-silicon via - Wikipedia

In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical ... Stern with their patent "Methods of Making Thru-Connections in Semiconductor Wafers" f...

https://en.wikipedia.org

US7339273B2 - Semiconductor device with a via hole having ...

A semiconductor substrate is etched to form a via hole from a back surface of the semiconductor substrate to a pad electrode. This etching is performed under an ...

https://patents.google.com

Via (electronics) - Wikipedia

Through-glass vias (TGV) have been studied by Corning Glass for semiconductor packaging, due to the reduced electrical loss of glass versus silicon packaging.

https://en.wikipedia.org

via - Semiconductor OneSource

via 7, hole etched in the interlayer dielectric which is then filled with metal, usually tungsten, to provide vertical connection between stacked up interconnect ...

http://www.semi1source.com

VIA Technologies - Wikipedia

As a fabless semiconductor company, VIA conducts research and development of its chipsets in-house, then subcontracts the actual (silicon) manufacturing to ...

https://en.wikipedia.org

What are the effects of thermal via holes? | 臺灣東芝電子零 ...

Via holes can thermally connect the top layer and the bottom layer of the PCB, increase the heat radiation area, ... Back to FAQs of All Semiconductor Devices.

https://toshiba.semicon-storag

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威鋒電子: 首頁

Vision, Leadership, Intelligence 威鋒電子(VIA Labs, Inc., VLI)是全球獨特兼具完整USB高速傳輸、USB Type-C 及USB PD 相關技術布局的控制晶片領導廠商。

https://www.via-labs.com

矽穿孔- 維基百科,自由的百科全書 - Wikipedia

矽穿孔(英語:Through Silicon Via, 常簡寫為TSV,也稱做矽通孔)是一種穿透矽晶圓或晶片的垂直互連。 TSV 是一種讓3D IC封裝遵循摩爾定律(Moore's Law)的互連 ...

https://zh.wikipedia.org