bond shear
bond shear. A process in which an instrument uses a chisel-shaped tool to shear or push a ball or wedge bond off the bond pad (see figure below). The force ... ,bond-shear code for ball and wedge bond, type 2 - bond shear. A separation of the wire bond where 1) a thin layer of the bonding surface metallization remains ...
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 bond shear 相關參考資料
bond shear test - 英中– Linguee词典
applies controlled shear deformation to a sample under test, to enable measurement of flow properties (such as shear viscosity from flow tests) and dynamic [...]. https://cn.linguee.com bond shear | JEDEC
bond shear. A process in which an instrument uses a chisel-shaped tool to shear or push a ball or wedge bond off the bond pad (see figure below). The force ... https://www.jedec.org bond-shear code for ball and wedge bond, type 2 - bond ...
bond-shear code for ball and wedge bond, type 2 - bond shear. A separation of the wire bond where 1) a thin layer of the bonding surface metallization remains ... https://www.jedec.org bond-shear code for ball and wedge bond, type 5 - shearing ...
This condition may be due to improper placement of the specimen, a high shear height, or instrument malfunction. This bond shear type is not acceptable; the ... https://www.jedec.org edge bond shear test - 邊緣剪力試驗 - 國家教育研究院雙語詞彙
以edge bond shear test 進行詞彙精確檢索結果. 出處/學術領域, 英文詞彙, 中文詞彙. 學術名詞 航空太空名詞, edge bond shear test, 邊緣剪力試驗. 學術名詞 http://terms.naer.edu.tw Introduction to Wire Bond Pull & Ball Shear Testing
Microelectronics wire bond or ball shear testing can evaluate bond quality & verify bond consistency & reliability. https://www.palomartechnologie Wire Bond Ball Shear Application Note - Knowles Capacitors
Wirebonding is an electrical interconnection technique using thin wire and a combination of heat, pressure and/or ultrasonic energy. Wire bonding is a solid phase ... https://www.knowlescapacitors. WIRE BOND SHEAR TEST | JEDEC
The wire bond shear test is destructive. The test method can also be used to shear aluminum and copper wedge bonds to a die or package bonding surface. https://www.jedec.org 封裝打線強度試驗(Wire Bond Test) - iST宜特
... 有強度不足與汙染的風險。此實驗目的，即為藉由打線拉力(Wire bond pull)與推力(Wire bond shear)來驗證接合能力，確保其封裝可抵抗外在應力。 https://www.istgroup.com |