tan cvd
Title: A comparative study of CVD TiN and CVD TaN diffusion barriers for copper interconnection. Authors: Sun, SC · Tsai, MH · Chiu, HT · Chuang, SH · Tsai, CE ,Cu CVD on TaN and TaSiN Substrates. 3.1 Introduction. Copper has been used to replace Al and Al-alloys as the interconnection metal because of its higher ...
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 tan cvd 相關參考資料
A comparative study of CVD TiN and CVD TaN ... - IEEE Xplore
In this paper, the barrier properties of metalorganic CVD TiN and CVD TaN between Cu and Si under similar process conditions are compared. Thermal stabilit. https://ieeexplore.ieee.org A comparative study of CVD TiN and CVD TaN diffusion ...
Title: A comparative study of CVD TiN and CVD TaN diffusion barriers for copper interconnection. Authors: Sun, SC · Tsai, MH · Chiu, HT · Chuang, SH · Tsai, CE https://ir.nctu.edu.tw Chapter 3 Cu CVD on TaN and TaSiN Substrates
Cu CVD on TaN and TaSiN Substrates. 3.1 Introduction. Copper has been used to replace Al and Al-alloys as the interconnection metal because of its higher ... https://ir.nctu.edu.tw Chemical studies of CVD Cu deposited on Ta and TaN ...
Contamination in the matrix of CVD copper films and at the interface between CVD copper films and barrier layers has been characterized using XPS, SIMS, ... https://www.sciencedirect.com Chemical Vapor Deposition (CVD) of ... - Harvard University
Keywords: manganese, chemical vapor deposition, diffusion barrier, copper, ... nature of sputtered barrier (TaN), adhesion (Ta) and seed (Cu) layers has caused ... http://faculty.chemistry.harva CVD CuIMP CuTaNSiO2Si structures - SPIE Digital Library
We report the properties of the copper films deposited by metal-organic chemical vapor deposition (MOCVD) and the interaction between the copper film and its ... https://www.spiedigitallibrary CVD 鍍膜技術- 俊尚科技Junsun Tech: 真空鍍膜（PVD＆CVD ...
化學氣相沉積（Chemical Vapor Deposition，CVD）是一種用來產生純度高、性能 ... 層（氮化鉭阻障層，TaN barrier layer）外，也可透過本技術來處理微小的電路結構。 https://www.junsun.com.tw Electromigration Characteristics and Morphological Evolution ...
The Cu resistance on a TaN/Ru barrier increased gradually and ... that Cu had a strong bond with CVD Ru liner, even at high temperatures. https://ieeexplore.ieee.org Electromigration comparison of selective CVD cobalt capping ...
Secondary ion mass spectroscopy (SIMS) studies of PVD TaN barrier/CVD Co liner structures indicates that top-surface segregation of the Mn-dopant in alloy ... https://ieeexplore.ieee.org |