csp package
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. Acc,
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 csp package 相關參考資料
晶片尺寸封裝- 维基百科，自由的百科全书
晶片尺寸構裝（Chip Scale Package, CSP）是一種半導體構裝技術。 最早CSP只是晶片尺寸封裝的縮寫。根據IPC的標準J-STD-012, "Implementation of Flip Chip and Chip Scale Technology"，以符合晶片規模，封装必須有一個面積不超過1.2倍，更大的模具和它必須一個單晶片，直接表面貼裝封裝。 由於可攜式... https://zh.wikipedia.org Chip-scale package - Wikipedia
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning ... https://en.wikipedia.org 「csp package」的圖片搜尋結果
:// 晶圓級晶片尺寸封裝（wafer level chip scale package,WLCSP）
由於可攜式電腦與消費電子產品的外形尺寸日趨縮小，以致內部可供放置電子元件的空間也日益減小，因此對於近晶片尺寸或晶片尺寸構裝（chip scale package, CSP）的需求快速增加。如此一來許多不同的封裝方式如：多晶片模組（multi-chip module, MCM）、球柵陣列（ball grid array,BGA）、覆晶（flip chip, FC）等 ... http://www.360doc.com Philips Lumileds談晶片級封裝(CSP) - LEDinside
晶片級封裝(Chip Scale Package,CSP)成為2013年LED業界最具話題性技術，相較於CSP技術已在半導體產業行之有年，CSP在LED產業仍屬先進技術，Philips Lumileds也在最新探討CSP技術文章中談到，CSP技術過去自在半導體(矽)的發展正是為了縮小封裝體積、改善散熱問題以及提升晶片可靠度，而業界已 ... https://www.ledinside.com.tw Understanding Flip-Chip and Chip-Scale Package Technologies and ...
Abstract: Driven by the trend to smaller, lighter, and thinner consumer products, smaller package types have been developed. Indeed, packaging has become a key determinant for using or abandoning a de... https://www.maximintegrated.co CSP - Chip Scale Package - EESemi.com
The IPC/JEDEC definition likewise doesn't define how a chip scale package is to be constructed, so any package that meets the surface mountability and dimensional requirements of the definition is... http://eesemi.com The Chip Scale Package (CSP) - Intel
The Chip Scale Package (CSP). 15. 15.1. Introduction. Since the introduction of Chip Scale Packages (CSP's) only a few short years ago, they have become one of the biggest packaging trends in rece... https://www.intel.com AN3846 - Wafer Level Chip Scale Package (WLCSP) - NXP ...
Wafer Level Chip Scale Package refers to the technology of packaging an integrated circuit at the wafer level, instead of the traditional process of assembling individual units in packages after dicin... https://www.nxp.com Chip Scale Package – Wikipedia
Chip Scale Package (CSP, engl.; zu deutsch Gehäuse in der Größenordnung des Die) ist ein Chipgehäuse von integrierten Schaltungen, bei dem das Gehäuse maximal 20 % mehr Fläche als das Die ausmacht, wo... https://de.wikipedia.org |