Spil BGA
EDHS-BGA. Exposed Drop-in Heat Sink BGA. Siliconware's EDHS-BGA is a unique low cost solution for medium power applications (3-5W). With traditional ... ,The package offers ball counts in excess of 2597 with higher electrical performance compared to the traditional BGA package. Siliconware offers the flip chip ...
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Products - BGA - EBGA - SPIL
EBGA is a cavity down, thermally enhanced BGA with laminated substrate. They are suitable solutions for high power dissipation applications (> 6W). https://www.spil.com.tw Products - BGA - EDHS-BGA - SPIL
EDHS-BGA. Exposed Drop-in Heat Sink BGA. Siliconware's EDHS-BGA is a unique low cost solution for medium power applications (3-5W). With traditional ... https://www.spil.com.tw Products - BGA - Flip Chip Packages - SPIL
The package offers ball counts in excess of 2597 with higher electrical performance compared to the traditional BGA package. Siliconware offers the flip chip ... https://www.spil.com.tw Products - BGA - PBGA - SPIL
PBGA. Plastic Ball Grid Array. PBGA is a die-up design, plastic overmolded BGA using 2, 4 or 6 layer BT substrate and 0.8 or 1.0 or 1.27mm ball pitch and above ... https://www.spil.com.tw Products - BGA - SPIL
The Siliconware BGA line-up includes cavity-up and cavity-down designs utilizing advanced substrate technologies. What is a BGA Package? The Ball Grid Array ( ... https://www.spil.com.tw Products - CSP - TFBGA VFBGA - SPIL
23, 2020. Home > Products > CSP > TFBGA / VFBGA · BGA · EDHS-BGA · Flip Chip Packages · PBGA · CSP · FC-CSP · LGA · QFN · TFBGA ... https://www.spil.com.tw Products - Multi-Package - SPIL
Siliconware's Multi-Package BGA provides an alternative multi-chip module solution when know-good-die, KGD, is not feasible. Multiple chips are integrated ... https://www.spil.com.tw Products - SPIL
Siliconware Stacked die packages are continuously being upgraded to meet these demands... Siliconware's Multi-Package BGA provides an alternative multi-chip ... https://www.spil.com.tw Technology - SPIL
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. It allows ... https://www.spil.com.tw 網站導覽 - SPIL
BGA · EDHS-BGA · Flip Chip Packages · PBGA · CSP · FC-CSP · LGA · QFN · TFBGA / VFBGA · WLCSP · Stacked Die · Multi-Package... https://www.spil.com.tw |